从精密加工到整线交付，为医疗器械制造提供激光装备与工艺解决方案。Laser equipment and process solutions for medical device manufacturing, from precision processing to automated production.
六大制造板块 · 19个应用场景，按您的行业快速查找方案Six manufacturing sectors · 19 applications. Find the solution for your industry.
骨钉、螺钉、接骨板：UDI唯一标识追溯码、螺纹精密切削Bone screws, plates & spinal cages: UDI traceability marking, precision thread cutting
冠脉支架、球囊导管、瓣膜：镍钛合金/钴铬合金微管材切割、导管打孔Coronary stents, balloon catheters & valves: nitinol/CoCr micro-tubing cutting, catheter drilling
钛合金髋关节、颌面修复体、牙冠：个性化定制多孔结构成型Titanium hip joints, maxillofacial implants & dental crowns: customized porous structure forming
微型手术刀、止血钳、吻合器、活检钳：微型件精密焊接、器械UDI打标Micro scalpels, hemostats, staplers & biopsy forceps: micro-part precision welding, UDI marking
隐形牙套、义齿、种植体：透明膜片切割、种植体表面处理与打标Clear aligners, dentures & implants: transparent sheet cutting, implant surface treatment and marking
人工晶体、隐形眼镜模具：亲水材料精密切削、模具微结构加工IOLs & contact lens molds: hydrophilic material precision cutting, mold microstructuring
内窥镜、胃镜：镜体微型组件密封焊接Endoscopes & gastroscopes: hermetic welding of miniature scope-body components
注射器、留置针、采血针、胰岛素笔：针管与针座焊接、刻度与UDI打标Syringes, IV catheters, blood collection needles & insulin pens: needle-hub welding, graduation and UDI marking
输液器、导尿管、气管插管、造口袋：软管打孔、封口、裁切Infusion sets, urinary catheters, ET tubes & ostomy bags: hole drilling, sealing and cutting
血氧探头、压力传感器、起搏器外壳：微型元器件焊接、气密封装SpO2 probes, pressure sensors & pacemaker housings: micro-component welding, hermetic packaging
核酸检测机、试剂封装：设备铭牌/器件打标、试剂管塑料焊接密封PCR analyzers & reagent sealing: equipment/component marking, plastic welding of reagent tubes
微流控芯片、器官芯片、基因测序芯片：透明亚克力/PC/COC键合焊接、微流道刻蚀成型Microfluidic, organ-on-chip & NGS chips: acrylic/PC/COC bonding, microchannel etching
CGM传感器电极（铂/金/银氯化银薄膜电极）：柔性基板多层金属电极切割与图形化、传感窗口膜片切割、发射器外壳打标CGM sensor electrodes (Pt/Au/AgAgCl thin films): multilayer electrode cutting & patterning on flexible substrates, sensor-window membrane cutting, transmitter housing marking
96孔板、PCR管、移液吸头：批号打码、精密开孔96-well plates, PCR tubes & pipette tips: lot coding, precision perforation
犹他阵列/硅微针电极、皮层电极（ECoG）：硅/铂铱合金微针阵列精密切割、针尖成型、记录位点开窗Utah arrays, silicon micro-needle & ECoG electrodes: precision cutting of Si/PtIr needle arrays, tip forming, recording-site openings
柔性电极（聚酰亚胺/液晶聚合物薄膜）、神经织网：薄膜图形化切割、激光剥离（LLO）转印、微孔加工Flexible electrodes (PI/LCP films), neural mesh: film patterning, laser lift-off (LLO) transfer, micro-hole machining
BCI植入体钛/陶瓷外壳、馈通、光遗传植入体：气密封装焊接、电极-导线微焊接、植入式光纤端面处理BCI implant Ti/ceramic housings, feedthroughs & optogenetic implants: hermetic welding, electrode-wire micro-welding, implantable fiber end-face processing
缓释片剂、胶囊、药用玻璃安瓿：药片激光钻孔（控释孔）、安瓿激光切割Extended-release tablets, capsules & ampoules: tablet laser drilling (release orifice), ampoule cutting
铝塑泡罩、西林瓶、注射笔：追溯码/效期打码、防伪标记Blister packs, vials & injection pens: traceability/expiry coding, anti-counterfeit marking
统一型号编码体系：ZROptics-工艺-序号，快速定位设备方案Unified model coding: ZROptics-Process-No. for quick equipment selection
心血管支架（超快精密切割）、海波管/滤器、骨科接骨板、牙套、人工晶体、导管打孔封切、CGM电极、BCI微针阵列与柔性界面Stent ultrafast precision cutting, hypotube/filters, orthopedic plates, aligners, IOLs, catheter cutting, CGM electrodes, BCI micro-needle arrays and flexible interfaces
切缝微米级、无热变形无毛刺，支架网筋20~30μmMicron-level kerf, no heat distortion or burrs; stent strut width 20–30 μm
内窥镜气密封焊、起搏器/ICD钛壳氦检密封焊、针头焊接、试剂盒/微流控透射键合、BCI植入封装Endoscope hermetic welding, pacemaker/ICD titanium housing He-leak-tested sealing, needle welding, reagent-kit/microfluidic transmission bonding, BCI implant packaging
手工焊10s/件 → 激光焊1.5s/件，机器人自动化量产Manual welding 10 s/pc → laser welding 1.5 s/pc, robotic mass production
骨科UDI赋码、手术器械、核酸检测机、微孔板批号、药品包装追溯码Orthopedic UDI coding, surgical instruments, PCR analyzers, microplate lot coding, pharma packaging traceability
耐134℃反复高温高压灭菌不掉标，符合GS1规范Marks survive repeated 134 °C autoclave sterilization; GS1 compliant
人工晶体、透析膜、导管侧孔、缓释片控释孔IOLs, dialysis membranes, catheter side holes, extended-release tablet orifices
微米级微孔阵列，超快冷加工Micron-scale hole arrays, ultrafast cold processing
钛合金关节、颌面修复体、牙冠个性化多孔结构成型Titanium joints, maxillofacial implants, dental crowns with customized porous structures
SLM选区熔化，植入物级生物相容SLM (selective laser melting), implant-grade biocompatibility
微流控芯片流道、种植体表面微结构与柔性电极图形化加工。Microfluidic channels, implant surface microstructures and flexible electrode patterning.
皮秒 / 飞秒激光，精细微结构加工Picosecond / femtosecond lasers for fine microstructures
面向眼科、血管介入、神经外科与医美的激光光源整体配套方案Complete laser-source solutions for ophthalmology, vascular intervention, neurosurgery and aesthetics
| 设备方向Device Direction | 临床应用Clinical Application | 推荐光源Recommended Laser | 代表客户Key Clients |
|---|---|---|---|
| 眼科治疗设备Ophthalmic Treatment Devices | 全飞秒SMILE角膜切削、眼底微脉冲激光Femtosecond SMILE corneal surgery, micro-pulse fundus laser | 飞秒激光器、微脉冲半导体激光器Femtosecond laser; micro-pulse diode laser | 博视医疗（秩光眼底激光机器人）、蔡司、强生Bovision (robotic fundus laser), Zeiss, J&J |
| 血管介入激光消融Vascular Interventional Laser Ablation | 准分子/355nm冷激光斑块消蚀（三类介入设备）Excimer/355 nm cold laser plaque ablation (Class III interventional device) | 308nm准分子激光器；355nm固体激光器308 nm excimer laser; 355 nm solid-state laser | 中科微光（FastErazer）、SpectraneticsVivolight (FastErazer), Spectranetics |
| 神经外科激光消融Neurosurgical Laser Ablation | 磁共振引导激光间质热疗（LITT）：光纤植入病灶激光热消融，微创治疗难治性癫痫MR-guided laser interstitial thermal therapy (LITT): minimally invasive treatment of drug-resistant epilepsy | 大功率半导体激光器（980/1064nm）High-power diode laser (980/1064 nm) | 佳量医疗、美敦力（Visualase）Jialiang Medical, Medtronic (Visualase) |
| 医美激光设备Aesthetic Laser Devices | 点阵激光（皮肤屏障修复、疤痕治疗）、皮秒激光（祛斑、洗纹身）Fractional lasers (skin renewal, scar treatment), picosecond lasers (pigmentation, tattoo removal) | 皮秒Nd:YAG激光器；CO2点阵激光器Picosecond Nd:YAG; CO2 fractional laser | 奇致激光、半岛医疗、科英激光、赛诺秀Wonderlaser, Peninsular, Coherent(KY), Cynosure |
来自19个医疗应用场景的一线工艺经验总结Field-proven process insights from 19 medical application scenarios
原材料 · 核心光源 · 整机装备 · 工艺服务 一站式激光制造方案Materials · Laser Sources · Equipment · Process Services — One-stop Laser Manufacturing
专注医疗器械激光制造，覆盖切割、焊接、打标、钻孔、表面刻蚀和增材制造，提供从单机到自动化整线的方案。Focused on six medical laser processes: cutting, welding, marking, drilling, etching and additive manufacturing, from standalone systems to automated lines.
光纤、紫外、超快及 CO₂ 光源，配合运动控制与视觉定位，支持 UDI 打标、支架切割、塑料焊接及植入物 3D 打印。Fiber, UV, ultrafast and CO₂ sources with motion control and vision positioning for UDI marking, stent cutting, plastic welding and implant 3D printing.
产品符合 ISO 13485 医疗器械质量管理体系要求，支持洁净室与 GMP 环境部署；UDI 打标方案符合 NMPA / MDR / FDA 法规及 GS1 编码规范，植入物级加工工艺满足生物相容性与全程可追溯要求。Our products comply with the ISO 13485 medical device quality management system and support cleanroom and GMP deployment. UDI marking solutions conform to NMPA / MDR / FDA regulations and GS1 standards; implant-grade processes meet biocompatibility and full traceability requirements.
客户群体覆盖骨科植入、心血管介入、口腔数字化、眼科、体外诊断、CGM、脑机接口及制药包装等领域的头部医疗器械企业及其自动化集成商，提供打样验证 → 工艺开发 → 设备交付 → 售后培训全周期服务。We serve leading medical device manufacturers and their automation integrators across orthopedic implants, cardiovascular intervention, digital dentistry, ophthalmology, IVD, CGM, brain-computer interfaces and pharma packaging — with full-cycle services from sample verification and process development to equipment delivery and after-sales training.